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Forming Board Box
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Recommended material: Sicer-Sub A; Sicer-Gmd A
- Features
- Specifications
Advanced design concept
Low friction coefficient
Stable T-bar structure
High strength glass fiber base
No piano key thanks to dovetail groove structure
Precisely machined and easy to replace
Angle can be adjusted
Low adhesive rate of pulp fiber and filler particles
Effectively protect the wire
s.s304/321 stainless steel box
Low friction coefficient
Stable T-bar structure
High strength glass fiber base
No piano key thanks to dovetail groove structure
Precisely machined and easy to replace
Angle can be adjusted
Low adhesive rate of pulp fiber and filler particles
Effectively protect the wire
s.s304/321 stainless steel box
Thermal Conductivity |
Coefficient of Thermal Expansion |
Vickers Hardness (Kg/mm2) |
Fracture Toughness |
Bending Strength |
Bulk Density |
Material |
20-25 |
7.0-8.0 |
1450-1530 |
5.0-6.0 |
380-420 |
3.86-3.88 |
Sub-micron Aluminium Oxide |
18-20 |
7.0-8.0 |
1350-1450 |
4.0-5.0 |
360-400 |
3.81-3.84 |
High-purity Aluminium Oxide (G) |